Professor Juhyoung Chae’s research team (Department of Electronic and Communication Engineering) has developed a new data reception technology for next-generation LPDDR memory interfaces. The paper detailing this breakthrough was accepted at the 2026 International Solid-State Circuit Conference (ISSCC) and was successfully presented on Wednesday, February 18.​

(From left) Ki-su Lee, Master’s student; Chan-heum Han, PhD student; and Professor Ju-hyoung Chae.

Global Recognition in a Competitive Year

The 2026 ISSCC recorded its highest number of submissions ever, leading to the lowest acceptance rate in the conference's history. Out of only 257 papers selected globally, the team’s work was one of just 46 papers from South Korea, proving its exceptional academic and technical excellence.

Innovation in Low-Power Solutions

Authored by ​Gisu Lee (Master’s) and Chanheum Han (Ph.D. candidate) as co-first authors,​ the research was presented by Chanheum Han in Session 37 (Memory Interface). Supported by the Samsung Science & Technology Foundation, the study proposes a novel architecture to enhance power efficiency and data transmission performance, garnering significant interest from global industry leaders. 

Presentation by Professor Juhyung Chae’s research team at ISSCC 2026

Special Honor: IEEE SSCS Pre-Doctoral Achievement Award

In addition to the presentation, Chanheum Han was honored with the prestigious IEEE SSCS Pre-Doctoral Achievement Award. This elite program selects promising Ph.D. students based on their academic records and future potential, providing a cash prize and travel support. This year, the award was granted to only 30 students worldwide (5 from South Korea), further cementing Han’s status as a rising leader in semiconductor research.

About ISSCC: The "Semiconductor Olympics"

With a 70-year tradition, ISSCC is the premier global forum for integrated circuit design, widely regarded as the "Semiconductor Olympics." Each year, over 3,000 experts from world-leading companies, research institutes, and universities gather to unveil the latest cutting-edge semiconductor technologies.